Current Crowding Effect on Thermal Characteristics of Ni/Doped-Si Contacts

IEEE Electron Device Letters

Volumn 24, Issue 10, 2003, Pages 637-639

  Liao, Chien Neng ^a   Chen, Kuan Chia ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Contacts; Resistance heating; Simulation; Temperature measurement; Thermoelectricity

Indexed keywords

COMPUTER SIMULATION; CURRENT DENSITY; DOPING (ADDITIVES); ELECTRIC CONTACTS; ELECTRIC RESISTANCE; NICKEL; SILICON; THERMOELECTRICITY;

RESISTANCE HEATING;

VLSI CIRCUITS;

EID: 0141987497     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2003.817875     Document Type: Article

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