Reliability assessment of a plastic encapsulated RF switching device

Microelectronics Reliability

Volumn 38, Issue 10, 1998, Pages 1607-1610

  Mahajan, R ^a   Pecht, M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0141895752     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00020-1     Document Type: Article

References (6)

1. Pecht M, Nguyen L, Hakim E. Plastic encapsulated microcircuits. New York: Wiley, 1995.
2. Johnson B, Verma V. Reliability assessment of fielded plastic and hermetically packaged microelectronics. IEEE Trans. Reliability 1996;45:23-7.
3. Christou A. Reliability of gallium arsenide MMICs. New York: Wiley, 1992.
4. Grob B. Basic electronics. Singapore: McGraw Hill, 1984.
5. Hauser R. Military and aerospace electronic systems. In: Electronic packaging and interconnection handbook. New York: McGraw Hill, 1991.
6. MIL-STD-883E (Method 2011.7) Fig. 2011.1 Minimum bond pull limits.