A crack-qualification procedure for SMDs

SMT Surface Mount Technology Magazine

Volumn 10, Issue 4, 1996, Pages 52-54

  Gannamani, Ranjit ^a   Munamarty, Ramesh ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 4244099539     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (2)

1. M.G. Pecht, L.T. Nguyen and E.B. Hakim, Plastic Encapsulated Mecroelectronics: Materials, Processes, Quality, Reliability and Applicaitons, John Wiley & Sons Inc. New York, 1995.
2. P. Yalamanchili, R. Gannamaini, R. Munamarty, P. McCluskey P. and A. Christou, "Optimum Processing Prevents PQFP Popcoming," SMT Magazine, May 1995, p 39-42.