Characterization of Kovar-Pyrex anodically bonded samples - a new packaging approach for MEMS devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4180, Issue 1, 2000, Pages 76-83

  Vargo, Stephen E ^a   Green, A A ^a   Mueller, J ^b   Bame, D P ^b   Reinicke, R H ^c  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

^c Moog Space Products Division   (United States)

Author keywords

Anodic bonding; Kovar; Packaging; Pyrex

Indexed keywords

BONDING; ELECTRONICS PACKAGING; FAILURE ANALYSIS; INTERCONNECTION NETWORKS;

ANODING BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0034545393     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.395711     Document Type: Article

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