Channel cracking during thermal cycling of thin film multi-layers

International Journal of Fracture

Volumn 120, Issue 1-2, 2003, Pages 325-338

  Begley, M R ^a   Ambrico, J M ^b  

^a UNIVERSITY OF VIRGINIA   (United States)

^b NAVAL UNDERSEA WARFARE CENTER   (United States)

Author keywords

Creep; Cyclic temperatures; Feature size; Fracture; Multilayer; Ratcheting

Indexed keywords

CRACKS; DEFORMATION; MULTILAYERS; PLASTICITY; THERMAL CYCLING; THIN FILMS;

CHANNEL CRACKING;

CRACK INITIATION;

CRACKING; FILM;

EID: 0141817135     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1024915510009     Document Type: Article

References (13)

1. Ambrico, J.M. and Begley, M.R. (2002). The role of initial flaw size and plasticity in adjacent layers in channeling crack growth in thin films. Thin Solid Films 419, 144-153.
2. Ambrico, J.M., Jones, E.E. and Begley, M.R. (2001). Cracking in thin multilayers with finite-width and periodic architectures. International Journal of Solids and Structures 39, 1443-1462.
3. Begley, M.R. and Evans, A.G. (2001). Progressive cracking in a multi-layer system upon thermal cycling. Journal of Applied Mechanics 68, 513-520.
4. Beuth, J.L. and Klingbeil, J.W. (1996). Cracking of thin films bonded to elastic plastic substrates. Journal of the Mechanics and Physics of Solids 44, 1411-1428.
5. Beuth, J.L. (1992). Cracking of thin bonded films in residual tension. International Journal of Solids and Structures 29, 1657-1675.
6. Huang, M. Suo, Z. Ma, Q., and Fujimoto, H. (2000). Thin film cracking and ratcheting caused by temperature cycling. Journal of Materials Research 15, 1239-1242.
7. Huang, M., Suo, Z. and Ma, Q. (2001). Metal film crawling in interconnected structures caused by cyclic temperatures. Acta Materialia 49, 3039-3049.
8. Huang, M., Suo, Z. and Ma, Q. (2002). Plastic ratcheting induced cracks in thin film structures. Journal of the Mechanics and Physics of Solids 50, 1079-1098.
9. Hutchinson, J.W. and Suo, Z. (1992). Mixed mode cracking in layered materials. Advances in Applied Mechanics 29, 63-191.
10. Hu, M.S. and Evans, A.G. (1989). The cracking and decohesion of thin films on ductile substrates. Acta Metallurgica et Materialia 37, 917-925.
11. Liu, X.H., Suo, Z., Ma, Q. and Fujimoto, H. (2000). Developing design rules to avert cracking and debonding in integrated circuit structures. Engineering Fracture Mechanics 66, 387-402.
12. Maier, G. (2001). Low-dielectric constant polymers for microelectronics. Progress in Polymer Science 26, 3-65.
13. Weiss, D., Gao, H. and Arzt, E. (2001). Constrained diffusional creep in UHV-produced copper thin films. Acta Materialia 49, 2395-2403.