Fiducial mark and CTOA estimates of thin film adhesion

International Journal of Fracture

Volumn 120, Issue 1-2, 2003, Pages 431-439

  Volinsky, Alex A ^a   Moody, Neville R ^b   Gerberich, William W ^c  

^a MOTOROLA INC   (United States)

^b University of Minnesota   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Adhesion; Crack arrest; Crack tip opening angle; Delamination; Fiducial marks; Fracture; Thin films

Indexed keywords

ADHESION; BUCKLING; COMPRESSIVE STRESS; DELAMINATION; INDENTATION; RESIDUAL STRESSES; STRAIN; THIN FILMS;

BIAXIAL STRESSES;

FRACTURE TESTING;

CRACK TIP; DELAMINATION;

EID: 0141789812     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1024983930481     Document Type: Article

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