Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric film applications

Chemistry of Materials

Volumn 15, Issue 19, 2003, Pages 3721-3727

  Leu, Chyi Ming ^a   Chang, Yao Te ^a   Wei, Kung Hwa ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

MICROPHASE SEPERATIONS;

CRYSTAL STRUCTURE; DIELECTRIC FILMS; PERMITTIVITY; STRENGTH OF MATERIALS;

POLYAMIDES;

OLIGOMER; POLYIMIDE; SILICON DERIVATIVE; SILICON DIOXIDE; SILSESQUIOXANE; UNCLASSIFIED DRUG;

ARTICLE; CHEMICAL STRUCTURE; DIELECTRIC CONSTANT; ELECTRONICS; FILM; MATERIALS; NANOPARTICLE; SCANNING ELECTRON MICROSCOPY; SYNTHESIS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

EID: 0141596921     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm030393b     Document Type: Article

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