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Volumn 21, Issue 4, 2003, Pages 1318-1322

Embossing of polymers using a thermosetting polymer mold made by soft lithography

Author keywords

[No Author keywords available]

Indexed keywords

PLASTICS MOLDING; REACTIVE ION ETCHING; SILICON WAFERS; THERMOSETS;

EID: 0141458292     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1585066     Document Type: Conference Paper
Times cited : (18)

References (13)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.