Film stress characterization using substrate shape data and numerical techniques

Materials Research Society Symposium - Proceedings

Volumn 750, Issue , 2002, Pages 249-254

  Feng, Zhaohua ^a   Lovell, Edward G ^a   Engelstad, Roxann L ^a   Mikkelson, Andrew R ^a   Reu, Phillip L ^a   Sohn, Jaewoong ^a  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; NUMERICAL METHODS; STRESS ANALYSIS; SUBSTRATES; X RAY DIFFRACTION;

STRESS CHARACTERIZATION;

THIN FILMS;

EID: 0042968633     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-750-y3.4     Document Type: Conference Paper

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