Solder joint reliability of plastic ball grid array with solder bumped flip chip

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1997, Pages

  Lee, S W Ricky ^a   Lau, John H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; STRAIN; SUBSTRATES; THERMAL EXPANSION; THERMAL STRESS;

PLASTIC BALL GRID ARRAY (PBGA);

ELECTRONICS PACKAGING;

EID: 0031377362     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)