A Nested Finite Element Methodology (NFEM) for stress analysis of electronic products - Part II: Durability analysis of flip chip and chip scale interconnects

Journal of Electronic Packaging

Volumn 123, Issue 2, 2001, Pages 147-155

  Darbha, Krishna ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042406520     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1328745     Document Type: Article

References (17)

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10. Darbha, K., and Dasgupta, A., 1999, "A Nested Finite Element Methodology for stress analysis of flip chip on board Assemblies-Part 1: Elastic Analysis," ASME Interpack '99, June, Maui, Hawaii.
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