Thermomechanical multi-domain stress modeling for fatigue analysis of electronic packaging

IEEE Aerospace Conference Proceedings

Volumn 1, Issue , 1998, Pages 399-408

  Rassaian, Mostafa ^a   Lee, Jung Chuan ^a  

^a BOEING COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; CERAMIC MATERIALS; ELASTOPLASTICITY; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FUNCTIONALLY GRADED MATERIALS; NEWTON-RAPHSON METHOD; NONLINEAR PROGRAMMING; SOLDERED JOINTS; SOLDERING; STRESS ANALYSIS; AEROSPACE APPLICATIONS; FINITE ELEMENT METHOD; POLYNOMIALS; STRAIN; STRESS CONCENTRATION; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

BROYDEN-FLETCHER-GOLDFARB-SHANNO; CERAMIC BALL GRID ARRAYS; CERAMIC CHIP COMPONENTS; ELASTIC-PLASTIC ANALYSIS; ELECTRONIC PACKAGING; PLATED THROUGH HOLE; QUASI-NEWTON METHODS; UNKNOWN COEFFICIENTS;

FINITE ELEMENT METHOD; ELECTRONICS PACKAGING;

BALL GRID ARRAY (BGA) PACKAGES; RAYLEIGH-RITZ ENERGY METHOD; THERMOMECHANICAL MULTIDOMAIN STRESS MODELING;

EID: 0031645098     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.1998.686937     Document Type: Conference Paper

References (12)

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