A Nested Finite Element Methodology (NFEM) for stress analysis of electronic products - Part I: Theory and formulation

Journal of Electronic Packaging

Volumn 123, Issue 2, 2001, Pages 141-146

  Darbha, Krishna ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038817940     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1328744     Document Type: Article

References (10)

1. Houmat, A., 1997, "An alternative hierarchical finite element formulation applied to plate vibrations," J. Sound Vib., 206, No. 2, pp. 201-215.
2. Syed, A., 1997, "ACES of finite element and life prediction models for solder joint reliability," Design and Reliability of Solders and Solder Interconnections, R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw, and W. Winterbottom, eds., The Minerals, Metals and Materials Society, pp. 347-354.
3. Zienkiewicz, O. C., De, J. P., Gago, S. R., and Kelly, D. W., 1983, "The hierarchical concept in finite element analysis," Comput. Struct., 16, Nos. 1-4, pp. 53-65.
4. Ling, S., and Dasgupta, A., 1996, "A nonlinear multi-domain stress analysis method for surface-mount solder joints," ASME J. Electron. Packag., 118, June.
5. Ling, S., and Dasgupta, A., 1996, "A nonlinear multi-domain thermomechanical stress analysis method for surface-mount solder joints: Part II: viscoplastic analysis," Proceedings of 8th Annual Mechanics of Surface Mount Assemblies Symposium at the ASME International Mechanical Engineering Congress and Exposition, Atlanta, GA.
6. Ling, S., 1997, "A multi-domain Rayleigh-Ritz method for thermomechanical stress analysis of surface mount interconnects in electronic assemblies," Ph.D. dissertation, University of Maryland.
7. Rassaian, M., and Lee, J., 1998, "Thermomechanical multi-domain stress modeling for fatigue analysis of electronic packaging," 1998 IEEE Aerospace Conference, Los Alamitos, CA, Vol. 1, pp. 399-408.
8. Darbha, K., Okura, J., Dasgupta, A., and Caers, J. F. J. M., 1997, "A Multi-Domain Thermomechanical Stress Analysis Method for Flip Chip Solder Interconnects," ASME Winter Annual Conference, 1997, Loews, Anatole.
9. George, A., and Liu, J., 1981, Computer Solution of Large Sparse Positive Definite Systems, Prentice-Hall, New Jersey.
10. Cook, R. D., 1981, Concepts and applications of Finite Element Analysis, 2nd Ed., Wiley, NY.