Transmission electron microscopy of joints between the Sn-Ag solder and the electroless Ni-P of an electronic device

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 66, Issue 2, 2002, Pages 47-52

  Torazawa, Naoki ^a   Arai, Shigeo ^a   Shimoyama, Koji ^a   Takase, Yoshihisa ^a   Saka, Hiroyasu ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

Focused ion beam; Kirken dall void; Lead free solder; Nickel phosphorus; Semiconductor package; Strength; Transmission electron microscopy

Indexed keywords

ELECTRONIC EQUIPMENT; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; ION BEAMS; MICROSTRUCTURE; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

EUTECTIC SOLDERS;

JOINTS (STRUCTURAL COMPONENTS);

EID: 0036475045     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.66.2_47     Document Type: Article

References (11)

1. Lead-free soldering; Its direction and solution
2. 4