Novel techniques for packaging and interconnects in mm-wave communication front-ends

IEE Colloquium (Digest)

Volumn , Issue 83, 2000, Pages 1-18

  Menzel, Wolfgang ^a   Kassner, Jürgen ^b  

^a UNIVERSITY OF ULM   (Germany)

^b IMST GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; ELECTRONICS PACKAGING; ELECTROPLATING; INJECTION MOLDING; LOCAL AREA NETWORKS; MOBILE TELECOMMUNICATION SYSTEMS; OPTICAL COMMUNICATION; WAVE FILTERS; WAVEGUIDES;

METAL INJECTION MOULDING (MIM); METAL WAVEGUIDES; PACKAGE RESONANCE; PLANAR TRANSMISSION LINE CIRCUITS;

WAVEFRONTS;

EID: 0041503540     PISSN: 09633308     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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