An electromagnetically coupled package feed-through structure for multilayer carrier substrates

1998 28th European Microwave Conference, EuMC 1998

Volumn 2, Issue , 1998, Pages 428-432

  Kassner, J ^a   Menzel, W ^a  

^a UNIVERSITY OF ULM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MULTILAYERS;

CARRIER SUBSTRATE; DC ISOLATION; FEED THROUGH; HERMETIC SEALING; TOP LAYERS;

SUBSTRATES;

EID: 84897559945     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.1998.338191     Document Type: Conference Paper

References (7)

1. Menzel, W.: Packaging and interconnects for millimeter wave circuits: A review. "Annales de Telecommunications", France, Vol. 52 (1997), No. 3-4, pp. 145-154
2. Session on High Density Microwave Packaging Program. Proc. Of IEEE Intern. Microw. Symp. MTT-S, 1995, Orlando, USA, 169-184
3. Brown, R. L., Polinski, P. W., Shaikh, A. S.: Manufacturing of microwave modules using a lowtemperature cofired ceramics. IEEE Intern. Microw. Symp. MTT-S, 1994, San Diego, 1727-1730
4. Straub, G., Menzel, W.: Millimeter-Wave Monolithic Integrated Circuit Interconnects Using Electromagnetic Field Coupling. IEEE Trans. on CPMT, Pt. B, Vol. 19, May 1996, 278-282
5. K. S. Yee, "Numerical Solution of Initial Boundary Value Problems Involving Maxwell's Equation in Isotropic Media", IEEE Trans. Antennas Propagation, vol. 14, pp. 302-307, May 1966
6. Fang Jiayuan, "Absorbing Boundary Conditions Applied to Model Wave Propagation in Microwave Integrated Circuits", IEEE MTT, vol. 42, pp. 1506-1513, August 1994
7. W. Kuempel, I. Wolff: Digital signal processing of time domain field simulation results using the system identification method. MEEE Trans. on MTT42 (1994), 667-671