Innovative packaging and fabrication concept for a 28 GHz communication front-end

IEICE Transactions on Electronics

Volumn E82-C, Issue 11, 1999, Pages 2021-2028

  Menzel, Wolfgang ^a   Kassner, Jürgen ^b   Goebel, Uhland ^a  

^a UNIVERSITY OF ULM   (Germany)

^b AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

fabrication techniques; interconnects; Packaging; plastic injection molding; waveguide filters

Indexed keywords

EID: 0041892978     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (29)

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