Packaging and interconnects for millimeter wave circuits : A review

Annales des Telecommunications/Annals of Telecommunications

Volumn 52, Issue 3-4, 1997, Pages 145-154

  Menzel, Wolfgang ^a,b,c,d  

^a UNIVERSITY OF ULM   (Germany)

^b RWTH AACHEN UNIVERSITY   (Germany)

^c UNIVERSITY OF DUISBURG ESSEN   (Germany)

^d AEG   (Canada)

Author keywords

Coplanar line; Front end; Interconnection; Microstrip line; Microwave antenna; Microwave circuit; Millimetric wave; Packaging; Properties of materials; State of the art; Waveguide junction

Indexed keywords

EID: 3343025618     PISSN: 00034347     EISSN: 19589395     Source Type: Journal    
DOI: None     Document Type: Review

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