Design of passive components for K-band communication modules in LTCC environment

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 183-188

  Simon, W ^a   Kulke, R ^a   Wien, A ^a   Wolff, I ^a   Baker, S ^a   Powell, R ^a   Harrison, M ^a  

^a Inst of Mobile and Satellite   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTROMAGNETIC FIELDS; FINITE DIFFERENCE METHOD; HERMETIC SEALS; MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; NETWORK COMPONENTS; TELECOMMUNICATION LINKS; THREE DIMENSIONAL; TIME DOMAIN ANALYSIS; WAVEGUIDES;

COMMUNICATION LINK MODULE; LOW TEMPERATURE COFIRED CERAMIC SUBSTRATE; PASSIVE COMPONENTS;

ELECTRONICS PACKAGING;

EID: 0033354690     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)