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1
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84994439515
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For some leading references on 193 nm resists, see: (a) Allen R. D.; Wan I. Y.; Wallraff G. M.; DiPietro R. A.; Hofer D. C.; Kunz R. R. J. Photopolym. Sci. Technol. 1995, 8, 623.
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Allen, R.D.1
Wan, I.Y.2
Wallraff, G.M.3
DiPietro, R.A.4
Hofer, D.C.5
Kunz, R.R.6
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2
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0002838502
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Microelectronics Technology, Polymers for Advanced Imaging and Packaging
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Reichmanis E.; Ober C. K.; MacDonald S. A.; Iwayanagi T.; Nishikubo, T., Eds.; American Chemical Society: Washington, DC
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(b) Allen R. D.; Wan I. Y.; Wallraff G. M.; DiPietro R. A.; Hofer D. C.; Kunz R. R. in Microelectronics Technology, Polymers for Advanced Imaging and Packaging, Reichmanis E.; Ober C. K.; MacDonald S. A.; Iwayanagi T.; Nishikubo, T., Eds.; ACS Symposium Series 614, American Chemical Society: Washington, DC, 1995; p 255-270.
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Allen, R.D.1
Wan, I.Y.2
Wallraff, G.M.3
DiPietro, R.A.4
Hofer, D.C.5
Kunz, R.R.6
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5
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0029748674
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(e) Kunz R.R.; Palmateer S.C.; Forte A.R.; Allen R.D.; Wallraff G.M.; DiPietro R.A.; Hofer D.C. Proc SPIE 1996, 2724, 365.
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Kunz, R.R.1
Palmateer, S.C.2
Forte, A.R.3
Allen, R.D.4
Wallraff, G.M.5
DiPietro, R.A.6
Hofer, D.C.7
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6
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0029727391
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(a) Wallow T. I.; Houlihan F.M.; Nalamasu O.; Chandross E.A.; Neenan T.X.; Reichmanis E Proc SPIE 1996, 2724, 355
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(1996)
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Wallow, T.I.1
Houlihan, F.M.2
Nalamasu, O.3
Chandross, E.A.4
Neenan, T.X.5
Reichmanis, E.6
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7
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0002432804
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(b) Houlihan F.M.; Wallow T.I.; Timko A.; Neria E.; Hutton R.; Cirelli R.; Nalamasu O.; Reichmanis E. Proc SPIE 1997, 3049, 84
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Houlihan, F.M.1
Wallow, T.I.2
Timko, A.3
Neria, E.4
Hutton, R.5
Cirelli, R.6
Nalamasu, O.7
Reichmanis, E.8
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8
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0000449507
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(c) Houlihan F.M.; Wallow T.I.; Timko A.; Neria E.; Hutton R.; Cirelli R.; Nalamasu O.; Reichmanis E. J. Photopolym. Sci. Technol., 1997, 10, 511
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Houlihan, F.M.1
Wallow, T.I.2
Timko, A.3
Neria, E.4
Hutton, R.5
Cirelli, R.6
Nalamasu, O.7
Reichmanis, E.8
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10
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0001403006
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Takechi S.; Kaimoto Y.; Nozaki K.; Abe N. J. Photopolym. Sci. Technol. 1992, Vol 5, No 3, 439.
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Takechi, S.1
Kaimoto, Y.2
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Abe, N.4
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12
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0042237555
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(a) Allen, R.D.; Sooriyakumaran R.; Opitz J.; Wallraff G. M.; DiPietro R. A.; Breyta G.; Hofer D.; Kunz R.; Jayaraman S.; Shick R.; Goodall B.; Okoroanyanyu U.; Willson C.G. Proc SPIE, 1996, 2724, 341
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Allen, R.D.1
Sooriyakumaran, R.2
Opitz, J.3
Wallraff, G.M.4
DiPietro, R.A.5
Breyta, G.6
Hofer, D.7
Kunz, R.8
Jayaraman, S.9
Shick, R.10
Goodall, B.11
Okoroanyanyu, U.12
Willson, C.G.13
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(c) Okoroanyanwu U.; Shumikawa T.; Medeiros D. Willson C.G.; Niu J. Q.; Frechet J.M.J.; Byers J.; Allen R. Proc SPIE, 1997, 3049, 92.
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Byers, J.7
Allen, R.8
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Allen, G.; Bevington, J. C.; Eastmond, G. C.; Ledwith, A.; Russo, S.; Sigwalt, P. Eds; Pergamon: Oxford, Chapter 22, and references therein
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See Cowie, J. M. G. in Comprehensive Polymer Science; Allen, G.; Bevington, J. C.; Eastmond, G. C.; Ledwith, A.; Russo, S.; Sigwalt, P. Eds; Pergamon: Oxford, 1989; Vol. 4, Chapter 22, and references therein.
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Cowie, J.M.G.1
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17
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0346301736
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note
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The P(NB/MA/AAXX) nomenclature refers to feed ratio rather than experimentally determined composition as outlined in the experimental section of reference 2d.
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18
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0348192435
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Polymers for Microelectronics
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Thompson L. F.; Willson C. G.; Tagawa S. Eds; American Chemical Society: Washington DC
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Pascal, T.2
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a) Dammel R. In Diazonapthoquinone-based Resist; D. Shea Ed.; SPIE Optical Engineering Press, Bellingham Washington, 1993, p 1.
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Allen, R.D.; Opitz J.; Larson C.E.; DiPietro R. A.; Breyta G.; Hofer D. Proc SPIE, 1997, 3049, 44
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