Application of UV depth lithography and 3D-microforming for high aspect ratio electromagnetic microactuator components

Microsystem Technologies

Volumn 8, Issue 4-5, 2002, Pages 304-307

  Kohlmeier, T ^a   Seidemann, V ^b   Buttgenbach S ^b   Gatzen, H H ^a  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROMAGNETISM; ELECTROPLATING; EPOXY RESINS; MASKS; PHOTOLITHOGRAPHY; PHOTOSENSITIVITY; ULTRAVIOLET RADIATION;

ULTRAVIOLET (UV) LITHOGRAPHY;

MICROACTUATORS;

EID: 0036693359     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-001-0154-6     Document Type: Conference Paper

References (6)

1. Thinfilm technologies to fabricate a linear microactuator
2. UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole
3. A novel variable reluctance micromotor for linear actuation
4. Thick-layer resists for surface micromaching
5. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS
6. A novel fabrication process for 3D meander shaped micro coils in SU8 dielectric and their application to linear micro motors