Computational continuum modeling of solder interconnects: Applications

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1523-1527

  Burchett, S N ^a   Neilsen, M K ^a   Frear, D R ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0009744459     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)

1. Akay, H. U., Y. Tong, N. Paydar, 1992, "Thermal Fatigue Analysis of an SMT Solder Joint Using FEM Approach", J. Microcircuits and Electron. Packaging, vol. 116, pp. 79-88.
2. Pan, T.-Y, W.L. Winterbottom, 1990, "Thermal Cycling Induced Plastic Deformation in Solder Joints", ASME Winter Annual Meeting, Dallas TX.
3. Hacke, P., A. F. Sprecher, H. Conrad, 1993, "Computer Simulation of Thermomechanical Fatigue of Solder Joints Including Microstructural Coarsening", ASME J. Electronic Packaging, vol. 115, pp. 153-158.
4. Busso, E. P., M. Kitano, and T. Kumazawa, 1992, "A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints," J. Engr. Mater. Tech., Vol. 114, July 1992.
5. Guo, Z., A. F. Sprecher, and H. Conrad, 1992, "Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue," J. Electronic Packaging, Vol. 114, June 1992.
6. Biffle, J. H. and M. L. Blanford, "JAC2D - A Two-Dimensional Finite Element Computer Program for the Non-Linear Quasi-Static Response of Solids with the Conjugate Gradient Method," SAND93-1891, Sandia National Laboratories, May 1994.
7. Biffle, J. H., and M. L. Blanford, "JAC3D - A Three-Dimensional Finite Element Computer Program for the Non-Linear Quasi-Static Response of Solids with the Conjugate Gradient Method," SAND87-1305, Sandia National Laboratories, Febr. 1993.
8. Blanford, M. L., "JAS3D - A Multi-Strategy Iterative Code for Solid Mechanics Analysis - Release 1.3", Sandia National Laboratories, Febr. 1993.