Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 950-956

  Jang, Se Young ^a   Wolf, Juergen ^b   Ehrmann, Oswin ^b   Gloor, Heinz ^c   Reichl, Herbert ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b FRAUNHOFER IZM   (Germany)

^c Unaxis F�rstentum Liechtenstein ^*  (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; EUTECTICS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); SOLDERING ALLOYS; TIN ALLOYS;

BUMPING PROCESS; HIGH DENSITY INTERCONNECTION; INTERFACE REACTIONS; SOLDER BUMPING; UNDER BUMP METALLURGY;

ELECTRONICS PACKAGING;

EID: 0034836666     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927920     Document Type: Article

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