Crack initiation and growth in electronic packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 970-976

  Ileri, L ^a   Madenci, E ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; DELAMINATION; DISSIMILAR MATERIALS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; STRESS ANALYSIS; STRESS INTENSITY FACTORS;

STRAIN ENERGY DENSITY FIELD;

ELECTRONICS PACKAGING;

EID: 0029217926     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)