Crack length analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1746-1753

  Kim, Donghyun ^a   Dias Filho, Jose Marcio ^b   Park, Changyoung ^a   Mawer, Andrew ^c   Moon, Tess J ^a   Masada, Glenn Y ^a  

^a The University of Texas at Austin   (United States)

^b FEDERAL UNIVERSITY OF MINAS GERAIS   (Brazil)

^c MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; CRACKS; ELECTRONICS PACKAGING; STRAIN RATE; TEMPERATURE; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS;

CRACK LENGTH ANALYSIS; DYE PENETRATION; PLASTIC BALL GRID ARRAY PACKAGES; TIN LEAD ALLOYS; TIN SILVER ALLOYS;

SOLDERED JOINTS;

EID: 0038688690     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)

1. J. H. Lau and Y. H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, 1997
2. W. Engelmaier, "Solder Joints In Electronics: Design For Reliability," Design And Reliability of Solders and Solder Interconnections, The Minerals, Metals & Materials Society, pp 9-19, 1997
3. R.M.V. Pidaparti and X. Song, "Fatigue crack propagation life analysis of solder joints under thermal cyclic loading," Theoretical and Applied Fracture Mechanics, pp 157-164, 1996
4. T. Pan, "Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue Of Solder Joints," J. Electronic Packaging, Vol. 116, pp 163-170, September, 1994
5. T. Takemoto and M. Takahashi, "Tensile Test for Estimation of Thermal Fatigue Properties of Solder Alloys", J. Materials Science, v 32, n15, Aug 1 1997, pp 4077-4084.
6. J. Glazer, "Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review", J. Electronic Materials, v23, n8, 1994, pp 693-700.
7. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, and H. Reichl, "Reliability Assessment of Flip-Chip Assemblies with Lead-free Solder Joints", Proc. 2002 Electronic Components and Technology Conf., pp 1246-1255.
8. D. Kim and P. Elenius, "Deformation and Crack Growth Characteristics of SnAgCu vs 63Sn/Pb Solder Joints on a WLP in Thermal Cycle Testing", Proc. 2001 Electronic Components and Technology Conf., pp 681-686.
9. Z. Mei and J. W. Morris, Jr., "Fatigue Lives On 60Sn/40Pb Solder Joints Made With Different Cooling Rates," J. Electronic Packaging, pp 104-108, Vol. 114, June 1992.
10. M. C. Shine and L. R. Fox, "Fatigue of Solder Joints In Surface Mount Devices," Low Cycle Fatigue, ASTM STP 942, pp 588-610, 1988.
11. John H.L. Pang, K.H. Tan, X. Shi and Z. Wang, "Thermal Cycling Aging Effects on Solder Joint Properties", IPACK'01, pp 1171-1175, July 2001.
12. S. Ahat, L. Du, M. Sheng, L. Luo, W. Kempe, and J. Freytag, "Effects of Aging on the Microstructure and Shear Strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu Solder Joints", J. Electronic Materials, V29, N9, pp 1105-1109, 2000
13. Y. Miyazawa and T. Ariga, "Microstructural Change and Hardness of Lead Free Solder Alloys", Proc. 1999 Environmentally Conscious Design and Inverse Manufacturing, pp 16-619, Feb 1999
14. Z. Guo and H. Conrad, "Computer Modeling of Isothermal Low-cycle Fatigue of Pb-Sn Solder Joints," Proc. 1993 Electronic Components & Technology Conf., pp 831-838
15. Z. Guo and H. Conrad, "Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints," J. Electronic Packaging, pp 159-164, Vol 115, June 1993
16. R. Darveaux, "Solder Joint Fatigue Life Model," Design and Reliability of Solders and Solder Interconnections, The Minerals, Metals & Materials Society, pp 213-218, 1997.
17. J. Lau and C. Chang, "Solder Joint Crack Propagation Analysis of Wafer-Level Chip Scale Package on Printed Circuit Board Assemblies," Proc. 2000 Electronic Components & Technology Conf., pp 1360-1368
18. R. Satoh, K. Arakawa, M. Harada, and K. Matsui, "Thermal Fatigue Life of Pb-Sn Alloy Interconnections", IEEE Trans. on components, packaging and manufacturing technology, pp 224-232, Vol. 14, No.1, March 1991
19. C. Park, D. Jose, D. Kim, A. Mawer, G.Y. Masada, and T.J. Moon, "Crack Area Analysis of SnPb and SnAg Solder Joints in Plastic Ball Grid Array Packages from Dye Penetration Studies", IPACK'03
20. J. Sall, A. Lehman, and L. Creightoon, A Guide to Statistics and Data Analysis Using JMP and JMP In Software, 2nd edition, Duxbury 2001
21. J. Wesley Barnes, Statistical Analysis for Engineers and Scientists, McGraw Hill, 1994.