Thermal cycling aging effects on solder joint properties

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 1171-1175

  Pang, John H L ^a   Tan, Kwang Hong ^b   Shi, Xunqing ^c   Wang, Zhiping ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Microstructure; Reliability; Solder joint; Thermal cycling

Indexed keywords

RELIABILITY TESTING; SOLDER REFLOW PROCESS;

AGING OF MATERIALS; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; EUTECTICS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; GROWTH (MATERIALS); INTERMETALLICS; MATHEMATICAL MODELS; MICROSTRUCTURE; PRINTED CIRCUIT TESTING; RELIABILITY; SHEAR STRESS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TRANSDUCERS;

SOLDERED JOINTS;

EID: 0038708592     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. C.K. Yeo, S. Mhaisalkar and H.L.J. Pang, "Experimental Study of Solder Joint Reliability in a 256 Pin, 0.4 mm pitch PQFP", Journal of Electronic Manufacturing, Vol 6, No. 2, pp 67-78, 1996.
2. Lau, J., and Pao, Y. H., Solder Joint Reliability of BGA, CSP, Flip Chip, & Fine Pitch SMT Assemblies, McGraw Hill, 1997.
3. Shi, X. Q., Zhou, W., Pang, H. L. J., Wang, Z. P. and Wang, Y. P., "Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy", ASME Journal of Electronic Packaging, Vol 121, No. 3, pp179-185, 1999.
4. Morris, J. W., Jr., Tribula, D., Summers, T. S. E., and Grivas, D., "Chapter 7: The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joint", Solder Joint Reliability: Theory and Applications, Edited by Lau, H. John, Van Nostrand Reinhold, New York, 1991.
5. Morris, J. W., Jr., Freer Goldstein, J. L., and Mei, Z., "Chapter 2: Microstructural Influences on the Mechanical Properties of Solder", The Mechanics of Solder Alloy Interconnects, edited by Frear, Darrel, Morgan, Harold, Burchett, Steven and Lau, John, Van Nostrand Reinhold, 1994.
6. Marshall, J. L., Foster, A., and Sees, J. A., "Chapter 3: Interfaces and Intermetallics", The Mechanics of Solder Alloy Interconnects, edited by Frear, D., Morgan, H., Burchett, S., and Lau, J., Van Nostrand Reinhold, 1994.