Crack area analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 701-708

  Park, Changyoung ^a   Filho, Jose Marcio Dias ^b   Kim, Donghyun ^a   Mawer, Andrew ^c   Masada, Glenn Y ^a   Moon, Tess J ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b FEDERAL UNIVERSITY OF MINAS GERAIS   (Brazil)

^c MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DATA PROCESSING; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; MICROSTRUCTURE; SOLDERED JOINTS; STATISTICAL METHODS; STRESSES; THERMAL CYCLING; THERMAL EXPANSION; THERMAL LOAD; DIES; PACKAGING; SOLDERING; SOLDERING ALLOYS;

BALL GRID ARRAY; DYE PENETRATION STUDIES; THERMAL FATIGUE; ACCELERATED THERMAL CYCLES; AGING CONDITIONS; CRACK GROWTH; CRITICAL ISSUES; DYE PENETRATION; ELECTRONIC PACKAGE; EXPERIMENTAL DATA; PLASTIC BALL GRID ARRAYS; PROCESS CONDITION; ROOM TEMPERATURE; SN-AG SOLDER; SOLDER JOINTS; SOLDER REFLOW; STATISTICAL ANALYSIS; TEMPERATURE CYCLES;

SOLDERING ALLOYS; CRACKS;

EID: 1242309495     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35028     Document Type: Conference Paper

References (13)

1. K. N. Tu and K. Zeng, "Reliablity Issues of Pb-free Solder Joints in Electronic Packaging Technology", Proc. 2002 Electronic Components and Technology Conf., p1194-1200.
2. See website www.nemi.org/PbFreePUBLIC.
3. Lead-Free Solder Project Final Report, National Center for Manufacturing Sciences, Ann Arbor, MI, Aug 1997.
4. T. Takemoto and M. Takahashi, "Tensile Test for Estimation of Thermal Fatigue Properties of Solder Alloys", J. Materials Science, v 32, n15, Aug 1, 1997, p 4077-4084.
5. J. Glazer, "Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review", J. Electronic Materials, v23, n8, 1994, p693-700.
6. A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, and H. Reichl, "Reliability Assessment of Flip-Chip Assemblies with Lead-free Solder Joints", Proc. 2002 Electronic Components and Technology Conf., p1246-1255.
7. D. Kim and P. Elenius, "Deformation and Crack Growth Characteristics of SnAgCu vs 63Sn/Pb Solder Joints on a WLP in Thermal Cycle Testing", Proc. 2001 Electronic Components and Technology Conf., p681-686.
8. Z. Mei and J. W. Morris, Jr., "Fatigue Lives On 60Sn/40Pb Solder Joints Made With Different Cooling Rates," Trans. ASME, v114, p104-108, June 1992
9. John H.L. Pang, K.H. Tan, X. Shi and Z. Wang, "Thermal Cycling Aging Effects on Solder Joint Properties", Proc. 2001 INTERPACK Conf. and Exp., p1171-1175.
10. S. Ahat, L.Du, M. Sheng, L. Luo, W. Kempe, and J. Freytag, "Effetcts of Aging on the Microstructure and Shear Strength of SnPbAg/Ni-P/Cu and SnAg/Ni-P/Cu Solder Joints", J. Electronic Materials, v29, n 9, p1105-1109, 2000
11. R. Darveaux, "Crack Initiation and Growth in Surface Mount Solder Joints", Proc. 1993 Intl. Symp. on Microelectronics, p86-97.
12. R. Darveaux, "Solder Joint Fatigue Life Model," Design and Reliability of Solders and Solder Interconnections, The Minerals, Metals & Materials Society, 1997, p213-218.
13. R. Katchmar, E. Goulet and J. Laliberte, "Factors Influencing Fatigue Life of Area-Array Solder Joints", Proc. 1996 Intl. Symp. on Microelectronics, p551-556.