Fatigue crack propagation life analysis of solder joints under thermal cyclic loading

Theoretical and Applied Fracture Mechanics

Volumn 24, Issue 2, 1996, Pages 157-164

  Pidaparti, R M V ^a   Song, X ^a  

^a Indiana University Purdue University Indianapolis   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FATIGUE LIFE ANALYSIS; JOINTS; SOLDERED;

CRACK INITIATION; CRACK PROPAGATION; CRACKS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FORECASTING; INTERFACES (MATERIALS); LEAD; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; THERMAL LOAD;

CRACK GROWTH RATE; FATIGUE CRACK PROPAGATION LIFE ANALYSIS; FINITE ELEMENT SIMULATIONS; STRAIN ENERGY RELEASE RATE METHOD; THERMAL CYCLIC LOADING;

FRACTURE MECHANICS;

EID: 0029657503     PISSN: 01678442     EISSN: None     Source Type: Journal    
DOI: 10.1016/0167-8442(95)00039-9     Document Type: Article

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