3D thermal-ADI - An efficient chip-level transient thermal simulator

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2003, Pages 10-17

  Wang, Ting Yuan ^a   Lee, Yu Min ^a   Chen, Charlie Chung Ping ^b  

^a University of Wisconsin Madison   (United States)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

ADI; Automation; Design; Finite difference methods; Temperature; Thermal simulation

Indexed keywords

ALGORITHMS; AUTOMATION; BOUNDARY CONDITIONS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COMPUTER SOFTWARE; FINITE ELEMENT METHOD; LARGE SCALE SYSTEMS; VLSI CIRCUITS; WORLD WIDE WEB;

THERMAL SIMULATION;

MICROPROCESSOR CHIPS;

EID: 0038379168     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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