FRACTURE AND DAMAGE EVALUATION IN CHIP SCALE PACKAGES AND FLIP-CHIPASSEMBLIES BY FEA AND MICRODAC

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1997-J, Issue , 1997, Pages 133-138

  Auersperg, Jürgen ^a   Schubert, Andreas ^a   Vogel, Dietmar ^a   Michel, Bernd ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; BENDING TESTS; CHIP SCALE PACKAGES; CRACKS; DEBONDING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE; INTEGRATED CIRCUIT INTERCONNECTS; INTERFACES (MATERIALS); OPTICAL CORRELATION; SOLDERING; STRAIN MEASUREMENT;

CHIP-CHIP; CHIP-SCALE PACKAGE; DAMAGE EVALUATION; ELECTRONIC PACKAGE; FLIP CHIP ASSEMBLIES; FRACTURE AND DAMAGES; FRACTURE EVALUATION; IN-CHIP; SOLDER INTERCONNECT; THERMOMECHANICAL RELIABILITY;

SCANNING ELECTRON MICROSCOPY;

EID: 85126981372     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1997-0508     Document Type: Conference Paper

References (18)

1. Amestoy, H.D.; Bui, H.D.; Labbens, R., “On the Definition of Local Path Independent Integrals in 3-D Crack Problems", Meeh. Res. Comm., Vol.8 (1981), pp. 231-236
2. Auersperg, J., Vogel, D., Simon, J., Schubert, A., Michel, B. “Reliability Evaluation of Chip Scale Packages by FEA and microDAC", Proc. Symp. on Design and Reliability of Solders and Solder Interconnects held during the TMS Annual Meeting, Orlando, Feb. 9-13th, 1997, pp. 439-445
3. Brust, F. W., Atluri, S. N., “Studies on Creep Crack Growth using the T'- Integral", Engng. Fract. Meeh., 23(1986)3, pp. 551-574
4. Brust, F. W., Nishioka, T., Atluri, S. N., Nkagaki, M., “Further Studies on Elastic-Plastic Stable Fracture Utilizing the T*- Integral”, Engng. Fract. Meeh., 23(1986)3, pp. 551-574
5. Hacke, P. L., Sprecher, A. L., Conrad, H., “Thermomechanical Fatigue of 63Sn-37Pb Solder Joints", in Lau, J. H., “Thermal Stress and Strain in Microelectronics Packaging", 1993, Van Nostrand Reinhold, New York
6. Hennig, K., Michel, B., Sommer, J.-P., “Crack Tip Temperature Fields in Visco-plastic Materials", Proc. 6th Int. Conf, on Fracture (ICF 6), New Dehli, Dec. 4-lOth, 1984, pp. 2587-2594
7. Ju, S. H., Dander, B. I., Plesha, M. E., "Life Prediction of Solder Joints by Damage and Fracture Mechanics", Joum, of Electronic Packages, Vol. 118, Dec., 1996, pp. 193-200
8. Landes, J. D., Begley, J. A., "A Fracture Mechanics Approach to Creep Crack Growth", in Mechanics of Crack Growth, ASTM STP 590, 1976, pp. 128-148
9. Lau, J. H., “Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibrational Conditions", IEEE Transactions on Components, Packaging and Manufacturing Technology - Part B, Vol. 19, Nov. 4th, 1996, pp. 728-735
10. Michel, B., Kiihnert, R., “Evaluation of Fracture Concepts by Means of Laser Experiments and the Scanning Micro Moire Method", Int. Conf, on Fracture and Fracture Mechanics (ICFFM), Shanghai, April, 1987
11. Michel, B., Will, P., Auersperg, J., Winkler, T., "Integral Concepts of Fracture Mechanics - Deterministic and Probabilistic Approach", in Fracture Mechanics Applications in Lifetime Estimation of Power Plant Components (ed. S. Sedmak), EMAS London, 1990, pp. 1-15
12. Michel, B., "Generalized and Nonlinear Fracture Concepts for Advanced Materials", 6th Int. Conf, on Mechanical Behavior of Materials (ICM 6), Kyoto, Japan, Aug. 1991
13. Michel, B., Winkler, T., Reichl, H., “Fracture Electronics Application of Fracture Mechanics to Microelectronic Systems and Chip Packages". 9th Int. Conf, on Fracture (ICF 9), Sydney, April l-5th, 1997
14. Miyamoto, H., Kikuchi, M.. “Three-dimensional J-lntegral“, Theoretical and Applied Mechanics, 28(1980), pp. 195-204
15. Schubert, A., Dudek, R., Michel, B., Reichl, H., "Materials Mechanics and Mechanical Reliability of Flip Chip Assemblies on Organic Substrates", Proc. 3rd Int. Symp. and Exhib. on Advanced Packaging Materials, Braselton, Georgia, Mar. 9-12th, 1997, pp. 106-109
16. Simon, J., Auersperg, J., Schubert, A., Michel, B., Reichl, H., "A Computational Comparison of Different CSP Approaches", Technical Digest of 3rd. VLSI Packaging Workshop of Japan, Kyoto, Dec. 2-4th, 1996, pp. 80-83
17. Vogel, D., Auersperg, J., Schubert, A., Michel, B., Reichl, H., "Deformation Analysis on Flip Chip Solder Interconnects by MicroDAC", Proc. Symp. on Design and Reliability of Solders and Solder Interconnects held during the TMS Annual Meeting, Orlando, Feb. 9-13th, 1997, pp. 429-438
18. Vogel, D., Schubert, A., Michel, B., Reichl, H., "MicroDAC - A New in-situ Deformation Measurement Method for Advanced Packages", 2nd BGA/Flip Chip Packaging Workshop, Binghampton, USA, Oct. 23-25th, 1996