Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading - Part III: Material properties and package geometries

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 407-411

  Saitoh, Takehiro ^a   Matsuyama, Hidehito ^a   Toya, Masayuki ^b  

^a NEC CORPORATION   (Japan)

^b KAGOSHIMA UNIVERSITY   (Japan)

Author keywords

Die bonding material; Encapsulant resin; Finite element method; Fracture mechanics; Leadframe; LSI; Package; Resin cracking; Stress analysis; Stress singularity; Temperature cyclic loading; Thermal stress

Indexed keywords

CRACK INITIATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTEGRATED CIRCUIT LAYOUT; LSI CIRCUITS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL STRESS;

DIE BONDING MATERIALS; ENCAPSULANT RESINS; LEADFRAME MATERIALS; STRESS SINGULARITY;

ELECTRONICS PACKAGING;

EID: 0032203773     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730425     Document Type: Article

References (6)

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