Reliability evaluation of chip scale packages by FEA and microDAC

TMS Annual Meeting

Volumn , Issue , 1997, Pages 439-445

  Auersperg, J ^a   Vogel, D ^a   Simon, J ^a   Schubert, A ^a   Michel, B ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; RELIABILITY; THERMAL CYCLING; THERMODYNAMICS;

CHIP SCALE PACKAGES (CSP);

ELECTRONICS PACKAGING;

EID: 0031382745     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)