-
1
-
-
0026157950
-
Determination of yielding and debonding in Al-Cu thin films from residual stress measurements via diffraction
-
Shute C.J., Cohen J.B. Determination of yielding and debonding in Al-Cu thin films from residual stress measurements via diffraction. J. Mater. Res. 6:1991;950.
-
(1991)
J. Mater. Res.
, vol.6
, pp. 950
-
-
Shute, C.J.1
Cohen, J.B.2
-
2
-
-
33845268292
-
Thermal-stress-induced voiding in narrow, passivated Cu lines
-
Børgesen P., Lee J.K., Gleixner R., Li C.Y. Thermal-stress-induced voiding in narrow, passivated Cu lines. Appl. Phys. Lett. 60:1992;1706.
-
(1992)
Appl. Phys. Lett.
, vol.60
, pp. 1706
-
-
Børgesen, P.1
Lee, J.K.2
Gleixner, R.3
Li, C.Y.4
-
3
-
-
21144462942
-
Residual stress and fracture properties of magnetron sputtered Ti films on Si microelements
-
Ljungcrantz H., Hultman L., Sundgren J.E. Residual stress and fracture properties of magnetron sputtered Ti films on Si microelements. J. Vac. Sci. Technol., A, Vac. Surf. Films. 11:1993;543.
-
(1993)
J. Vac. Sci. Technol., A, Vac. Surf. Films
, vol.11
, pp. 543
-
-
Ljungcrantz, H.1
Hultman, L.2
Sundgren, J.E.3
-
4
-
-
84878314341
-
Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films
-
Burnett A.F., Cech J.M. Relationship of crystallographic orientation and impurities to stress, resistivity, and morphology for sputtered copper films. J. Vac. Sci. Technol., A, Vac. Surf. Films. 11:1993;2970.
-
(1993)
J. Vac. Sci. Technol., A, Vac. Surf. Films
, vol.11
, pp. 2970
-
-
Burnett, A.F.1
Cech, J.M.2
-
5
-
-
0035882115
-
Measurements of residual stress in the thin film micro-gas sensors containing metallic layers
-
Kim Y., Choo S.H. Measurements of residual stress in the thin film micro-gas sensors containing metallic layers. Thin Solid Films. 394:2001;283.
-
(2001)
Thin Solid Films
, vol.394
, pp. 283
-
-
Kim, Y.1
Choo, S.H.2
-
7
-
-
0031130509
-
FMR, XRD and XHRTEM characterization of stresses in an epitaxial Ni-Cu film prepared on MgO(001) by d.c. biased plasma sputter deposition
-
Maruyama H., Qiu H., Hashimoto M., Fudaba K., Nakai H. FMR, XRD and XHRTEM characterization of stresses in an epitaxial Ni-Cu film prepared on MgO(001) by d.c. biased plasma sputter deposition. Thin Solid Films. 299:1997;59.
-
(1997)
Thin Solid Films
, vol.299
, pp. 59
-
-
Maruyama, H.1
Qiu, H.2
Hashimoto, M.3
Fudaba, K.4
Nakai, H.5
-
8
-
-
18244412509
-
Stress and structure profiles for chromium nitride coatings deposited by r.f. magnetron sputtering
-
Nouveau C., Djouadi M.A., Banakh O., Sanjinés R., Lévy F. Stress and structure profiles for chromium nitride coatings deposited by r.f. magnetron sputtering. Thin Solid Films. 398-399:2001;490.
-
(2001)
Thin Solid Films
, vol.398-399
, pp. 490
-
-
Nouveau, C.1
Djouadi, M.A.2
Banakh, O.3
Sanjinés, R.4
Lévy, F.5
-
9
-
-
0009732780
-
Polarization interferometer as a proximity sensor
-
Stoyanov H.Y. Polarization interferometer as a proximity sensor. Opt. Laser Technol. 32:2000;147.
-
(2000)
Opt. Laser Technol.
, vol.32
, pp. 147
-
-
Stoyanov, H.Y.1
-
10
-
-
0029512537
-
Stress reduction for hard amorphous hydrogenated carbon thin films deposited by the self-bias method
-
Yamada H., Tsuji O., Wood P. Stress reduction for hard amorphous hydrogenated carbon thin films deposited by the self-bias method. Thin Solid Films. 270:1995;220.
-
(1995)
Thin Solid Films
, vol.270
, pp. 220
-
-
Yamada, H.1
Tsuji, O.2
Wood, P.3
-
11
-
-
0014789535
-
Electromigration damage in aluminum film conductors
-
Attardo M.J., Rosenberg R. Electromigration damage in aluminum film conductors. J. Appl. Phys. 41:1970;2381.
-
(1970)
J. Appl. Phys.
, vol.41
, pp. 2381
-
-
Attardo, M.J.1
Rosenberg, R.2
-
12
-
-
0001099030
-
Control of microstructure and properties of copper films using ion-assisted deposition
-
Roy R.A., Cuomo J.J., Yee D.S. Control of microstructure and properties of copper films using ion-assisted deposition. J. Vac. Sci. Technol., A, Vac. Surf. Films. 6:1988;1621.
-
(1988)
J. Vac. Sci. Technol., A, Vac. Surf. Films
, vol.6
, pp. 1621
-
-
Roy, R.A.1
Cuomo, J.J.2
Yee, D.S.3
-
13
-
-
0032496505
-
A study on the crystallographic orientation with residual stress and electrical property of Al films deposited by sputtering
-
Kim S.P., Choi H.M., Choi S.K. A study on the crystallographic orientation with residual stress and electrical property of Al films deposited by sputtering. Thin Solid Films. 322:1998;298.
-
(1998)
Thin Solid Films
, vol.322
, pp. 298
-
-
Kim, S.P.1
Choi, H.M.2
Choi, S.K.3
-
14
-
-
0035426626
-
Dependence of stresses on grain orientations in thin polycrystalline films on substrates: An explanation of the relationship between preferred orientations and stresses
-
Zhang J.M., Xu K.W., Vincent J. Dependence of stresses on grain orientations in thin polycrystalline films on substrates: an explanation of the relationship between preferred orientations and stresses. Appl. Surf. Sci. 180:2001;1.
-
(2001)
Appl. Surf. Sci.
, vol.180
, pp. 1
-
-
Zhang, J.M.1
Xu, K.W.2
Vincent, J.3
-
15
-
-
0004608114
-
Thermal strain in lead thin films: IV. Effects of multiple cycling to 4.2 K
-
Murakami M., Angelillo J., Huang H.W., Segmuller A., Kircher C.J. Thermal strain in lead thin films: IV. Effects of multiple cycling to 4.2 K. Thin Solid Films. 60:1979;1.
-
(1979)
Thin Solid Films
, vol.60
, pp. 1
-
-
Murakami, M.1
Angelillo, J.2
Huang, H.W.3
Segmuller, A.4
Kircher, C.J.5
|