Novel approach to high current hermetic packaging

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1998, Pages 516-520

  Morozowich, D K ^a  

^a POWEREX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; COPPER; LEAKAGE CURRENTS; METALLIZING;

HIGH CURRENT HERMETIC PACKAGING;

ELECTRONICS PACKAGING;

EID: 0031706198     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)