Furnace and laser methods of bonding metals to ceramics: Phenomenological investigation

Materials Science and Engineering B: Solid-State Materials for Advanced Technology

Volumn 68, Issue 3, 2000, Pages 186-195

  Curicuta, V ^a   Poulain, D E ^a   Alexander, D R ^a   De Angelis, R J ^a   Gasser, S ^b   Kolawa, E ^b  

^a UNIVERSITY OF NEBRASKA LINCOLN   (United States)

^b CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COPPER; DIFFUSION IN SOLIDS; FURNACES; HEAT TRANSFER; LASER BEAMS; MATHEMATICAL MODELS; METAL DRAWING; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SAPPHIRE;

DIRECT BONDING; TRANSIENT LIQUID PHASE BONDING;

BONDING;

EID: 0033882308     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(99)00587-5     Document Type: Article

References (27)

1. Babcock, Method of Direct Bonding Metals to Non-Metallic Substrates, US Patent 3,766,634, (10/23/1973).
2. Nobuyuki Mizunoya et al., Method for directly bonding ceramic and metal members and laminated body of the same, US Patent 4,849,292, (7/18/1989).
3. Pedraza A.J. Metal-ceramic bonding by pulsed laser processing. Mater. Man. Process. 8(2):1993;239-257.
4. A.J. Pedraza, J.W. Park, Laser-Activation of Insulators for Electroless Deposition, Proc. 2nd Int. Conf. Beam Processing of Advanced Materials, 30 October-2 November, 1995, Cleveland, OH.
5. G. Daurelio, N. Ammannati, Effeto di Depositi Superficiali Sula Sadatura a Laser di Laminatidi Rame, La Metallurgia Italiana, 83 (7-8) (1991).
6. Uglov A.A., Volkov A.A. et al. Growth kinetics of oxide films and their effect on absorption of IR radiation. Spektrosk. 68:1990;640-645.
7. Ravichondon N., Parsad Y.V.R.K. Influence of oxygen on dynamic recrystallization during hot/working of polycrystalline copper. Mat. Sci. Eng. A156:1992;195-204.
8. Uglov A.A., Volkov A.A. et al. Metal Fusion by Laser Radiation Action in an Oxidizing Medium. 1990;Plenum Publishing, New York.
9. Uglov A.A., Volkov A.A. et al. Calculating Kinetics of Oxide Film Growth during Laser Heating. 1990;Plenum, New York.
10. H.K. Tonshoff, C. Emmelman, Laser Processing of Ceramics, Proc. Power Beam Conf., 2-4 May, 1988, San Diego, CA.
11. J.F. Ready, Laser Application in Material Processing, SPIE 198, 27-28 August, 1979, San Diego, CA.
12. Curicuta V., Alexander D.R., De Angelis R.J., Robertson B.W. Method of direct bonding of metals to ceramics. US Patent, 586,714. 5:1996;12/24/.
13. Curicuta V., Alexander D.R., De Angelis R.J., Robertson B.W., Poulain D.E. Laser method of bonding metals to ceramics. OSA TOPS Lasers Opt. Manufact. 9:1997;60-66.
14. Lax M. Temperature rise induced by laser beam II. The nonlinear case. Appl. Phys. Lett. 33(8):1978;786-788.
15. Burgener M.L., Reedy R.E. Temperature distributions produced in two-layer structure by scanning cw laser or electron beam. J. Appl. Phys. 53(6):1982;4357-4363.
16. Cole K.D., McGahan W.A. Theory of multilayers heated by laser absorption. J. Heat Transfer. 115:1993;767.
17. Emil N., Sobol N. Phase Transformations and Ablation in Laser-Treated Solids. 1995;5-15 Wiley, New York.
18. M. von Allmen, A. Blatter, Laser-Beam Interactions with Materials, second ed., Springer-Verlag, New York, 1995, pp. 5-14, 44-48, and 125-130.
19. P. Allaire, Basics of the Finite Element Method, Wm. C. Brown Publishers, Dubuque, IA, 1985, pp. 558-600.
20. T.R. Jervis, J.-P. Hirvonen, M. Nastasi, Laser surface processing in the ultra violet for tribological applications in metals and ceramics, J. Advanced Mater. 4-10, (1993).
21. Moya F., Moya E.G., Juve D., Treheux D., Grattepain C., Aucuturier M. Study of copper diffusion into bulk alumina. Scripta Metal. Mat. 28:1993;343-348.
22. Zhou Y., Gale W.F., North T.H. Modeling of transient liquid phase bonding. Int. Mat. Rev. 40(5):1995;181-196.
23. Venkatraman R., Wilcox J.R., Cain S.R. Experimental study of the kinetics of transient liquid phase solidification reaction in electroplated gold-thin layers on copper. Metall. Mat. Trans. (A). 28:1997;669-706.
24. Poku T., Dollar M., Massalski T.B. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metall. Trans. (A). 19:1988;675-686.
25. Ikeuchi K., Zhou Y., Kokawa H., North T.H. Liquid-solid interface migration at grain boundary regions during transient liquid phase brazing. Metall. Trans. (A). 23:1992;2905-2915.
26. Kokawa H., Lee C.H., North T.H. Effect of grain boundaries on isothermal solidification during transient liquid phase brazing. Metall. Trans. (A). 22:1991;1627-1631.
27. S. Liu, D.L. Olson, G.P. Martin, G.R. Edwards, Modeling of brazing processes that use coatings and interlayers, Weld. Res. Suppl. August 1991, 207-215.