Influence of AlN intergranular phases on wetting and bonding between copper and aluminum nitride

Key Engineering Materials

Volumn 206-213, Issue I, 2001, Pages 555-558

  Joyeux, T ^a   Jarrige, J ^a   Labbe, J C ^a   Lecompte, J P ^a  

^a UNIVERSITY OF LIMOGES   (France)

Author keywords

Aluminum nitride; Copper; Direct Bonding Copper (DBC); Joining; Thermal diffusivity; Wettability; YAG; YAM; YAP; Yttrium aluminates

Indexed keywords

ALUMINUM NITRIDE; BONDING; DENSIFICATION; MICROSTRUCTURE; SUBSTRATES; THERMAL DIFFUSION; WETTING;

DIRECT BONDING COPPER (DBC) PROCESS;

COPPER;

EID: 0034772505     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (5)