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Key Engineering Materials

Volumn 206-213, Issue I, 2001, Pages 535-538

Oxygen influence on wetting and bonding between copper and aluminum nitride

(5) Joyeux, T a Jarrige, J a Labbe, J C a Lecompte, J P a Alexandre, T a

a UNIVERSITY OF LIMOGES (France)

Author keywords

Aluminum nitride; Copper; Direct Bonding Copper (DBC); Joining; Oxygen; Thermal properties; Wettability

Indexed keywords

BONDING; COPPER; HEAT LOSSES; INTERFACES (MATERIALS); OXIDATION; OXYGEN; SCANNING ELECTRON MICROSCOPY; WETTING;

DIRECT BONDING COPPER (DBC) PROCESS;

ALUMINUM NITRIDE;

EID: 0034777735 PISSN: 10139826 EISSN: 16629795 Source Type: Book Series
DOI: None Document Type: Conference Paper

Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.