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Materials Research Society Symposium - Proceedings

Volumn 734, Issue , 2003, Pages 351-356

The nanomechanical effect of dendrimer interlayers underneath Cu ultrathin films

(3) Zhang, Junyan a Curry, Micheal a Street, Shane a

a University of Alabama (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DENDRIMERS; DEPOSITION; ELASTICITY; MONOLAYERS; SILICON WAFERS; THERMAL EFFECTS;

NANOMECHANICAL EFFECTS;

ULTRATHIN FILMS;

EID: 0038003747 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (2)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.