Thin film failure using an interface delamination law

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 43-48

  Liu, P ^a   Cheng, L ^a   Zhang, Y W ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CRACK PROPAGATION; DELAMINATION; FRACTURE; MICROELECTRONICS; STRENGTH OF MATERIALS;

INTERFACE DELAMINATION LAW;

THIN FILM DEVICES;

EID: 0032230618     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)