A unified viscoplastic fatigue damage model for 63Sn-37Pb solder alloy under cyclic stress control

International Journal of Damage Mechanics

Volumn 12, Issue 3, 2003, Pages 225-243

  Yang, X J ^a,c   Chow, C L ^a   Lau, K J ^b  

^a UNIVERSITY OF MICHIGAN DEARBORN   (United States)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^c SOUTHWEST JIAOTONG UNIVERSITY   (China)

Author keywords

Creep; Damage; Ratchetting; Solder alloy; Viscoplasticity

Indexed keywords

CREEP TESTING; CYCLIC LOADS; DEFORMATION; FATIGUE OF MATERIALS; LEAD ALLOYS; VISCOPLASTICITY;

RATCHETTING;

SOLDERING ALLOYS;

EID: 0037713230     PISSN: 10567895     EISSN: None     Source Type: Journal    
DOI: 10.1177/1056789503012003003     Document Type: Article

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