RF evaluation of low-cost leadless packages and development of distributed electrical models

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1550-1558

  Chandrasekhar, Arun ^a   Brebels, Steven ^a   Beyne, Eric ^a   De Raedt, Walter ^a   Nauwelaers, Bart ^b   Van Bever, Tania ^c  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c ON SEMICONDUCTOR   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; COMPUTER SIMULATION; DIES; ENCAPSULATION; INSERTION LOSSES; MATHEMATICAL MODELS; MULTICHIP MODULES; PERMITTIVITY; SEMICONDUCTING SILICON;

CHIP PACKAGE INTERCONNECT; NO-LEAD QUAD FLAT PACK PACKAGE; RETURN LOSS; SILICON DIE;

ELECTRONICS PACKAGING;

EID: 0037674330     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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