Distributed circuit models for near-CSP interconnects

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 63-66

  Chandrasekhar, Arun ^a   Beyne, Eric ^a   De Raedt, Walter ^a   Nauwelaers, Bart ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT THEORY; ELECTRONICS PACKAGING;

BGA PACKAGE; DISTRIBUTED CIRCUIT MODEL;

CIRCUIT SIMULATION;

EID: 84948763675     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057884     Document Type: Conference Paper

References (8)

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6. A. Chandrasekhar, E. Beyne, W. De Raedt, B. Nauwelaers and T. Van Bever. "Electrical Characterisation of the BGA Package for RF Applications", Proc. MicroTech 2002 (IMAPS-UK), Manchester, U.K., Jan 29-30,2002.
7. G. Carchon, P. Pieters, K. Vaesen. W. De Raedt, B. Nauwelaers and E. Beyne, "Multi-Layer Thin-Film MCM-D for the Integration of High Performance Wireless Front-end Systems", Microwave Journal, Vol. 44, Issue 2, pp. 96-1 10, Feb 2001.
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