Development of microwave package models utilizing on-wafer characterization techniques

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1948-1954

  Chun, Carl ^a   Pham, Anh Vu ^a   Laskar, Joy ^a   Hutchison, Brian ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Calibration; Mmic package; Package modeling

Indexed keywords

CALIBRATION; FREQUENCY RESPONSE; MATHEMATICAL MODELS; MICROWAVE CIRCUITS; MONOLITHIC INTEGRATED CIRCUITS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; WAVEGUIDES;

SURFACE-MOUNT PLASTIC PACKAGES;

ELECTRONICS PACKAGING;

EID: 0031249821     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641800     Document Type: Article

References (8)

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