Failure analysis of solder joints with a damage-coupled viscoplastic model

International Journal for Numerical Methods in Engineering

Volumn 56, Issue 14, 2003, Pages 2199-2211

  Wei, Y ^a   Chow, C L ^a   Neilsen, M K ^b   Fang, H E ^b  

^a University of Michigan Dearborn   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Damage; Finite element algorithm; Solder joint; Viscoplasticity

Indexed keywords

ELASTOPLASTICITY; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; VISCOPLASTICITY;

VISCOPLASTIC MODELS;

SOLDERED JOINTS;

FAILURE ANALYSIS;

EID: 0037654862     PISSN: 00295981     EISSN: None     Source Type: Journal    
DOI: 10.1002/nme.660     Document Type: Article

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