Aluminum diffusion and nitrogen sputter yield for nitrogen plasma immersion ion implantation into aluminum

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 3, 2003, Pages 643-648

  Manova, D ^a   Attenberger, W ^a   Mandl S ^b   Stritzker, B ^a   Rauschenbach, B ^a,c  

^a UNIVERSITY OF AUGSBURG   (Germany)

^b LEIBNIZ INSTITUTE OF SURFACE ENGINEERING IOM   (Germany)

^c UNIVERSITY OF LEIPZIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BINDING ENERGY; CRYSTAL STRUCTURE; DENSITY (SPECIFIC GRAVITY); DIFFUSION IN SOLIDS; HIGH TEMPERATURE EFFECTS; ION IMPLANTATION; NUMERICAL ANALYSIS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SATURATION (MATERIALS COMPOSITION); SPUTTERING; TRANSMISSION ELECTRON MICROSCOPY; VACUUM APPLICATIONS;

ATOMIC AREA DENSITIES; ELEMENT DISTRIBUTION; PLASMA IMMERSION ION IMPLANTATION;

ALUMINUM NITRIDE;

EID: 0037599257     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1566785     Document Type: Article

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