A technique for deducing in-plane modulus and coefficient of thermal expansion of a supported thin film

Journal of Engineering Materials and Technology

Volumn 124, Issue 2, 2002, Pages 274-277

  Chiang, Martin Y M ^a   Chiang, Chwan K ^a   Wu, Wen Li ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIATION (CALCULUS); ELASTIC MODULI; INTEGRAL EQUATIONS; LINEAR EQUATIONS; PLATES (STRUCTURAL COMPONENTS); STRAIN; SUBSTRATES; THERMAL EXPANSION; THERMAL STRESS;

BIMATERIAL PLATES; COEFFICIENT OF THERMAL EXPANSION (CTE); IN-PLANE MODULI; THERMAL EXPANSION STRAIN;

THIN FILMS;

EID: 0037595651     PISSN: 00944289     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1448522     Document Type: Article

References (15)

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