Thermal contact resistance of phase change and grease type polymeric materials

American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

Volumn 11, Issue , 2000, Pages 461-466

  Prasher, Ravi S ^a   Simmons, Craig ^a   Solbrekken, Gary ^b  

^a INTEL CORPORATION   (United States)

^b University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041114595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)

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2. Yovanovich, M.M., Culham, J.R., and Teertstra, P., 1997, "Calculating Interface Resistance," http: www.electronics-coolimg.com...ces/EC_Articles/May97/article3.html
3. Zhao, L., and Phelan, P. E., 1999, "Thermal Contact Conductance Across Filled Polyimide Films at Cryogenic Temeratures," Cryogenics, Vol. 39, PP. 803-809.
4. Fletcher, L.S., and Petersonm G.P. 1986, "The effect of Interstitial Materials on the Thermal Contact Conductance of Metallic Junctions," Heat Transfer in Systems seminar-PhaseII, National Cheng Kung University, Tainan, January 13-14
5. Madhusudana, C. V., 1996, "Thermal Contact Conductance," Mechanical engineering Series, Springer-Verlag, New York, PP. 1-100.
6. Snaith, B., O'Callaghan, P.W., and Probert, S. D., 1984, "Interstitial Materials for Controlling Thermal Conductances Across Pressed Metallic Contacts," Applied Energy, Vol. 16, PP. 175-191.
7. Taylor, B.N., and Kuyatt, C.E., 1994, "Guidelines for Evaluating and Expressing the Uncertainty of NIST Measurement Resulsts," NIST Technical Note 1297, United States Department of Commerce, Washington, DC.
8. Holman, J.P., 1994, Experimental Methods for Engineers, MCGraw-Hill, Newyork
9. Wu, S., 1982, Polymer Interface and Adhesion, Marcel Dekker, Inc., New York, PP. 1-26.
10. Cassie, A. B. D., and Baxter, S. 1944, "Wettability of Porous Surfaces," Transactions of the Faraday Society, Vol. XL, PP. 546-551
11. Solbrekken, G., Chiu, C-P, Byers, B, and Reichenbacher, D., 2000, "The Development of a Tool to Predict Package Level Thermal Interface Material Perforamance, to appear in the proceedings of ITHERM, Las Vegas