Thermal modeling of grease-type interface material in PPGA application

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 57-63

  Chiu, Chia Pin ^a   Solbrekken, Gary L ^a   Chung, Yoke D ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT RESISTANCE; HEAT SINKS; INTERFACES (MATERIALS); LUBRICATING GREASES; MATHEMATICAL MODELS; THERMAL CONDUCTIVITY;

CONTACT RESISTANCE; PLASTIC PIN GRID ARRAY; THERMAL GREASE;

ELECTRONICS PACKAGING;

EID: 0030832383     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)