Low melting point thermal interface material

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 671-676

  Webb, R L ^a   Gwinn, J P ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Central Processing Unit; Conducting materials; Contact resistance; Copper; Materials testing; Resistance heating; Surface resistance; Temperature; Thermal conductivity; Thermal resistance

Indexed keywords

CONTACT RESISTANCE; COPPER; ELECTRIC RESISTANCE; HEAT RESISTANCE; INTERFACES (MATERIALS); LUBRICATING GREASES; MATERIALS TESTING; MELTING POINT; PROGRAM PROCESSORS; SURFACE RESISTANCE; SURFACE TESTING; TEMPERATURE; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL CYCLING; THERMAL INSULATING MATERIALS; TINNING;

CONDUCTING MATERIALS; LOW MELTING TEMPERATURES; LOW THERMAL CONDUCTIVITY; MANUFACTURING METHODS; OPERATING TEMPERATURE; PERFORMANCE DEGRADATION; RESISTANCE-HEATING; THERMAL INTERFACE MATERIALS;

THERMAL CONDUCTIVITY;

EID: 1242306037     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012519     Document Type: Conference Paper

References (8)

1. Gwinn, J. P. and Webb, R.L. 2002 "Performance and testing of thermal interface materials." Proc. of THERMES 2002, San Jose, NM, pp. 201-210.
2. Chu, C.P., Solbrekken, G. L., LeBonheur, V. and Xu, Y.E. 2000. Application of Phase-Change Materials in Pentium ® III and Pentium ® III XeonTM Processor Cartridges. Intl. Symp. on Adv. Packaging Materials. 2000 pp. 265-270.
3. Cook, R.S., Token, K. H. and Calkins, R.L. 1984. "A Novel Concept For Reducing Thermal Resistance." J. Spacecraft, Vol. 21, No. 1, pp. 122-124.
4. Cook, R.S. and Token, K.H. 1983. "Simple Thermal Joint," U.S. Patent 4,384,610, May 24, 1983 (Issued to McDonnel Douglas Corp).
5. Lehman, Dr. G.L. and Davidson, D.A. 2001. "Thermal Performance of Liquid Solder Joint Between Metal Faces." Proc. of IPACK 2001. Paper # IPACK2001-15890.
6. Alpha Novatech, personal communication with Alpha Novatech applications engineer, October 8, 2001.
7. Gwinn, Joshua P., Saini, Manish and Webb, R.L. 2002. "Design of an Experimental Apparatus for Accurate Thermal Interface Material (TIM) Thermal Resistance Measurement." Proc. of ITherm 2002, San Diego, CA May 29-June 1, 2002.
8. Eaton, Manford. "Thermal Resistance Testing," 2002 'http://www.orcusinc.com/test-therm.htm'