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Volumn 47, Issue 3, 2003, Pages 549-552

A study of GaN etching characteristics using HBr-based inductively coupled plasmas

Author keywords

BCl3 HBr; Etch profile; GaN; OES; Photoresist mask

Indexed keywords

EMISSION SPECTROSCOPY; ETCHING; HYDROGEN INORGANIC COMPOUNDS; INDUCTIVELY COUPLED PLASMA; PHOTORESISTS;

EID: 0037345474     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(02)00411-2     Document Type: Conference Paper
Times cited : (6)

References (9)
  • 1
    • 0035269754 scopus 로고    scopus 로고
    • 2 and photoresist masks using an inductively coupled plasma
    • 2 and photoresist masks using an inductively coupled plasma. Jpn. J. Appl. Phys. Part 1. 40(3A):2001;1242-1243.
    • (2001) Jpn J Appl Phys Part 1 , vol.40 , Issue.3 A , pp. 1242-1243
    • Chang, L.1    Liu, S.2    Jeng, M.3
  • 3
    • 0001449046 scopus 로고    scopus 로고
    • High rate and selective etching of GaN, AlGaN, and AlN using an inductively coupled plasma
    • Smith S.A., Wolden C.A., Bremser M.D., Hanser A.D., Davis R.F. High rate and selective etching of GaN, AlGaN, and AlN using an inductively coupled plasma. Appl. Phys. Lett. 71(25):1997;3631-3633.
    • (1997) Appl Phys Lett , vol.71 , Issue.25 , pp. 3631-3633
    • Smith, S.A.1    Wolden, C.A.2    Bremser, M.D.3    Hanser, A.D.4    Davis, R.F.5
  • 5
    • 0035300626 scopus 로고    scopus 로고
    • Vertical high quality mirrorlike facet of GaN-base device by reactive ion etching
    • Chen C.H., Chang S.J., Su Y.K., Chi G.C., Sheu J.K., Lin I.C. Vertical high quality mirrorlike facet of GaN-base device by reactive ion etching. Jpn. J. Appl. Phys. Part 1. 40(4B):2001;2762-2764.
    • (2001) Jpn J Appl Phys Part 1 , vol.40 , Issue.4 B , pp. 2762-2764
    • Chen, C.H.1    Chang, S.J.2    Su, Y.K.3    Chi, G.C.4    Sheu, J.K.5    Lin, I.C.6
  • 6
    • 0033483675 scopus 로고    scopus 로고
    • Reactive ion etching of GaN and GaAs: Radially uniform processes for rectangular, smooth sidewalls
    • Franz G., Rinner F. Reactive ion etching of GaN and GaAs: radially uniform processes for rectangular, smooth sidewalls. J. Vac. Sci. Technol. A. 17(1):1999;56-61.
    • (1999) J Vac Sci Technol A , vol.17 , Issue.1 , pp. 56-61
    • Franz, G.1    Rinner, F.2
  • 7
    • 0012267701 scopus 로고    scopus 로고
    • The effect of etching gases on notching and charging in high-density plasma
    • Tabara S. The effect of etching gases on notching and charging in high-density plasma. Jpn. J. Phys. 37:1998;3570-3575.
    • (1998) Jpn J Phys , vol.37 , pp. 3570-3575
    • Tabara, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.